Superconformal Electrodeposition for 3-Dimensional Interconnects

Superconformal electrodeposition in submicron features.

Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local coverage in fine features changes more due to interface area change than by accumulation from the electrolyte, yielding superconformal growth. ...

Three Dimensional VLSI-Scale Interconnects

As processor speeds rapidly approach the Giga-Hertz regime, the disparity between process time and memory access time plays an increasing role in the overall limitation of processor performance. In addition, limitations in interconnect density and bandwidth serve to exacerbate current bottlenecks, particularly as computer architectures continue to reduce in size. To address these issues, we pro...

Effect of Additives on Shape Evolution during Electrodeposition III. Trench Infill for On-Chip Interconnects

Experimental observations are reported on the range of compositions and geometries for which void-free “superfilling” of rectangular trenches occurs during copper electrodeposition from acid sulfate solutions containing poly ethylene glycol , chloride, bis sodium sulfopropyl disulfide, and 12-hydroxyethyl -2-imidazolidine-thione. Observations were compared with predictions made with a model tha...

Generalized Superconformal Index for Three Dimensional Field Theories

Extended Superconformal Algebras on Ads 3

We study a supersymmetric extension of the Virasoro algebra on the boundary of the anti-de Sitter space-time AdS3. Using the free field realization of the currents, we show that the world-sheet affine Lie superalgebras osp(1|2)(1), sl(1|2)(1) and sl(2|2)(1) provide the boundary N = 1, 2 and 4 extended superconformal algebras, respectively. The duality between the type IIB string theory on AdS3 ...